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 StandardsCommon packages
   CC - Chip carrier packagesCP - Clamped packages (Press-pack)CY - Cylinder packagesDB - Disc-button packagesFO - Fiber optic packagesFM - Flange mount packagesFP - Flatpack packagesGA - Grid array packagesIP - In-line packagesLF - Long form packagesMA - Microelectronic assembly packagesMW - Microwave packagesPF - Press fit packagesPM - Post or stud mount packagesSO - Small outline packagesSS - Special shape packagesUC - Uncased chipsVP - Vertical surface-mount packages Manufacturer specific packages |  |  |