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SO, Small outline package

    A low-profile rectangular surface-mount component package. Its chip (die) is bonded to an inner land contact area, primarily a lead frame. External terminals exit parallel to the seating plane on two opposite sides of the molded, flat package.

NOTES
  1. The lead form is usually gull wing but other lead forms are possible.
  2. This term is deprecated in favor of "chip carrier" (see CC) or "flatpack" (see FP), depending on the lead form.

PDSO-G (SOIC, SSOP) packge view example
PDSO-G
(SOIC-G)
(SSOP-G)
SOIC-G16
SOIC-G18
SOIC-G24
SSOP-G20
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