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  • Standards
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  • Common packages
    • CC - Chip carrier packages
    • CP - Clamped packages (Press-pack)
    • CY - Cylinder packages
    • DB - Disc-button packages
    • FO - Fiber optic packages
    • FM - Flange mount packages
    • FP - Flatpack packages
    • GA - Grid array packages
    • IP - In-line packages
    • LF - Long form packages
    • MA - Microelectronic assembly packages
    • MW - Microwave packages
    • PF - Press fit packages
    • PM - Post or stud mount packages
    • SO - Small outline packages
    • SS - Special shape packages
    • UC - Uncased chips
    • VP - Vertical surface-mount packages
  • Manufacturer specific packages
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