| 
   
   | 
  
   
    
     
       
      | 
     
    
     | 
 
 
 
 
    
 - Standards
 
  
 - Common packages
 
  
   - CC - Chip carrier packages
 
   - CP - Clamped packages (Press-pack)
 
   - CY - Cylinder packages
 
   - DB - Disc-button packages
 
   - FO - Fiber optic packages
 
   - FM - Flange mount packages
 
   - FP - Flatpack packages
 
   - GA - Grid array packages
 
   - IP - In-line packages
 
   - LF - Long form packages
 
   - MA - Microelectronic assembly packages
 
   - MW - Microwave packages
 
   - PF - Press fit packages
 
   - PM - Post or stud mount packages
 
   - SO - Small outline packages
 
   - SS - Special shape packages
 
   - UC - Uncased chips
 
   - VP - Vertical surface-mount packages
 
   
 - Manufacturer specific packages
 
 
      | 
     
    
   | 
  
   
   |