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Partname:DS34T104GN+
Description: Single/Dual/Quad/Octal TDM-over-Packet Chip
Manufacturer:Maxim Integrated Products
Datasheet:PDF (1.31M).
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These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standardsbased TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in fullfeatured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

Click here to download DS34T104GN+ Datasheet
Click here to download DS34T104GN+ Datasheet
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