A -40°C to +125°C
C -0°C to +70°C
E -40°C to +85°C
I -20°C to +85°C
M -55°C to +125°C
|
 |
| A - | SSOP (Shrink Small-Outline Package) |
| B - | CERQUAD |
| C - | TO-220, TQFP (Thin Quad Flat Pack) |
| D - | Ceramic Sidebraze |
| E - | QSOP (Quarter Small-Outline Package) |
| F - | Ceramic Flat Pack |
| H - | Module, SBGA (Super Ball Grid Array, 5x5 TQFP) |
| J - | CERDIP Dual-In-Line |
| K - | TO-3, PPGA |
| L - | LCC (Leadless Ceramic Chip Carrier) |
| M - | MQFP (Metric Quad Flat Pack) |
| N - | Narrow Plastic Dual-In-Line |
| P - | Plastic Dual-In-Line |
| Q - | PLCC (Plastic Leaded Chip Carrier) |
| R - | Narrow CERDIP (300 mil) |
| S - | Small Outline (150 mil), TO-52 (2 or 3 leads) |
| T - | TO-5 Type (also TO-99, TO-100) |
| U - | TSSOP, µMAX, SOT |
| V - | TO-39 |
| W - | Small Outline, Wide (300 mil) |
| X - | SC-70 (3, 5, 6 leads) |
| Y - | Narrow Sidebraze (300 mil) |
| Z - | TO-92, MQUAD |
| /D - | Dice |
| /PR- | Rugged Plastic |
| /W - | Wafer |
|
 |
| A - | 8 |
| B - | 10, 64 |
| C - | 12, 192 |
| D - | 14 |
| E - | 16 |
| F - | 22, 256 |
| G - | 24 |
| H - | 44 |
| I - | 28 |
| J - | 32 |
| K - | 5, 68 |
| L - | 40 |
| M - | 7, 48 |
| N - | 18 |
| O - | 42 |
| P - | 20 |
| Q - | 2, 100 |
| R - | 3, 84 |
| S - | 4, 80 |
| T - | 6, 160 |
| U - | 60 |
| V - | 8 (0.200" pin circle, isolated case) |
| W - | 10 (0.230" pin circle, isolated case) |
| X - | 36 |
| Y - | 8 (0.200" pin circle, case to pin 4) |
| Z - | 10 (0.230" pin circle, case to pin 5) |
|