A -40°C to +125°C
C -0°C to +70°C
E -40°C to +85°C
I -20°C to +85°C
M -55°C to +125°C
|
 |
A - | SSOP (Shrink Small-Outline Package) |
B - | CERQUAD |
C - | TO-220, TQFP (Thin Quad Flat Pack) |
D - | Ceramic Sidebraze |
E - | QSOP (Quarter Small-Outline Package) |
F - | Ceramic Flat Pack |
H - | Module, SBGA (Super Ball Grid Array, 5x5 TQFP) |
J - | CERDIP Dual-In-Line |
K - | TO-3, PPGA |
L - | LCC (Leadless Ceramic Chip Carrier) |
M - | MQFP (Metric Quad Flat Pack) |
N - | Narrow Plastic Dual-In-Line |
P - | Plastic Dual-In-Line |
Q - | PLCC (Plastic Leaded Chip Carrier) |
R - | Narrow CERDIP (300 mil) |
S - | Small Outline (150 mil), TO-52 (2 or 3 leads) |
T - | TO-5 Type (also TO-99, TO-100) |
U - | TSSOP, µMAX, SOT |
V - | TO-39 |
W - | Small Outline, Wide (300 mil) |
X - | SC-70 (3, 5, 6 leads) |
Y - | Narrow Sidebraze (300 mil) |
Z - | TO-92, MQUAD |
/D - | Dice |
/PR- | Rugged Plastic |
/W - | Wafer |
|
 |
A - | 8 |
B - | 10, 64 |
C - | 12, 192 |
D - | 14 |
E - | 16 |
F - | 22, 256 |
G - | 24 |
H - | 44 |
I - | 28 |
J - | 32 |
K - | 5, 68 |
L - | 40 |
M - | 7, 48 |
N - | 18 |
O - | 42 |
P - | 20 |
Q - | 2, 100 |
R - | 3, 84 |
S - | 4, 80 |
T - | 6, 160 |
U - | 60 |
V - | 8 (0.200" pin circle, isolated case) |
W - | 10 (0.230" pin circle, isolated case) |
X - | 36 |
Y - | 8 (0.200" pin circle, case to pin 4) |
Z - | 10 (0.230" pin circle, case to pin 5) |
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