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Partname:XCCACEM16BG388I
Description:16 Mb system ACE MPM
Manufacturer:Xilinx Inc.
Package:BGA
Pins:388
Oper. temp.:-40 to 85
Datasheet:PDF (285K).
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The System ACETM Multi-Package Module (MPM) solution addresses the need for a space-efficient, pre-engineered, high-density configuration solution in multiple FPGA systems. The System ACE technology is a ground-breaking in-system programmable configuration solution that provides substantial savings in development effort and cost per bit over traditional PROM and embedded solutions for high capacity FPGA systems. As shown in Figure 1, the System ACE MPM solution is a multi-package module that includes the System ACE MPM controller, a configuration PROM, and an AMD Flash Memory.

Click here to download XCCACEM16BG388I Datasheet
Click here to download XCCACEM16BG388I Datasheet
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