The VI Chip Bus Converter Module (BCM) is a high efficiency (>95%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 4.75 V to 6.87 V secondary. The BCM may be used to power non-isolated POL converters or as an independent 4.75 6.87 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced--or eliminated--resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 974 W/in3 and may be surface mounted with a profile as low as 0.16" (4 mm) over the PCB. Its VI Chip power package is compatible with onboard or inboard surface mounting. The VI Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also available with heat sink options, assuring low junction temperatures and long life in the harshest environments.