The VI Chip Bus Converter Module (BCM) is a high efficiency (>95%), narrow input range Sine Amplitude Converter (SAC) operating from a 330 to 365 Vdc primary bus to deliver an isolated low voltage secondary. The off-line BCM provides an isolated 10.3 -11.4 V distribution bus and is ideal for use in silver boxes and PFC front ends. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced--or eliminated--resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 876 W/in3 in a VI Chip package compatible with standard pick-andplace and surface mount assembly processes. The VI Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-Board thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. Low junction to case and junction to lead thermal impedances assure low junction temperatures and long life in the harshest environments.