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Partname: | B048L120T10 |
Description: | VI Chip - BCM Bus Converter Module |
Manufacturer: | |
Datasheet: | PDF (725K). Click here to download *) |
The BCM achieves a power density of 400 W/in3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its VI Chip power BGA package is compatible with on-board or in-board surface mounting. The VI Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also compatible with heat sink options, assuring low junction temperatures and long life in the harshest environments. |
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