The BCM achieves a power density of 800 W/in3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its VI Chip power package is compatible with on-board or in-board surface mounting. The VI Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also compatible with heat sink options, assuring low junction temperatures and long life in the harshest environments.