The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller. Each amplifier has three gain stages with on-die interstage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated closed-loop power control within the module. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The latter is set directly from the Vramp input from the DAC. The module has Tx enable and band select inputs. Excellent performance is achieved across the 824 849 MHz, 880 915 MHz, 1710 1785 MHz, and 1850 1910 MHz bands. Module construction is a low-profile overmolded land-grid array on laminate.