The TPS54311, TPS54312, TPS54313, TPS54314, TPS54315 and TPS54316 devices are available in a thermally enhanced 20-pin TSSOP (PWP) PowerPADTM package, which eliminates bulky heatsinks. TI provides evaluation modules and the SWIFT designer software tool to aid in quickly achieving high-performance power supply designs to meet aggressive equipment development cycles.