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Partname:PA2423MB
Description:2.4 GHz bluetooth class 1 power amplifier IC.
Manufacturer:
Package:MSOP
Pins:8
Oper. temp.:-40 to 85
Datasheet:PDF (370K).
Click here to download *)

The silicon/silicon-germanium structure of the PA2423MB and its exposed-die-pad package, soldered to the system PCB provide high thermal conductivity and a subsequently low junction temperature. This device is capable of operating at a duty cycle of 100 percent.

Click here to download PA2423MB Datasheet
Click here to download PA2423MB Datasheet
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