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Partname: | PA2423MB |
Description: | 2.4 GHz bluetooth class 1 power amplifier IC. |
Manufacturer: | |
Package: | MSOP |
Pins: | 8 |
Oper. temp.: | -40 to 85 |
Datasheet: | PDF (370K). Click here to download *) |
The silicon/silicon-germanium structure of the PA2423MB and its exposed-die-pad package, soldered to the system PCB provide high thermal conductivity and a subsequently low junction temperature. This device is capable of operating at a duty cycle of 100 percent. |
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![Click here to download PA2423MB Datasheet](../../../pndecoder/datasheets/SIGE/img/000001.gif) Click here to download PA2423MB Datasheet*) |
![](http://www.chipdocs.com/common/img/1x10t.gif) |
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