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| Partname: | PA2423G |
| Description: | 2.4 GHz bluetooth class 1 power amplifier IC. |
| Manufacturer: | |
| Package: | Golg bump bare die |
| Pins: | 12 |
| Oper. temp.: | -40 to 85 |
| Datasheet: | PDF (388K).
Click here to download *) |
The silicon/silicon-germanium structure of the PA2423G provides high thermal conductivity and a subsequently low junction temperature. This device is capable of operating at a duty cycle of 100 percent. |
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Click here to download PA2423G Datasheet*) |
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