|
|
Partname: | PA2423G |
Description: | 2.4 GHz bluetooth class 1 power amplifier IC. |
Manufacturer: | |
Package: | Golg bump bare die |
Pins: | 12 |
Oper. temp.: | -40 to 85 |
Datasheet: | PDF (388K). Click here to download *) |
The silicon/silicon-germanium structure of the PA2423G provides high thermal conductivity and a subsequently low junction temperature. This device is capable of operating at a duty cycle of 100 percent. |
|
![Click here to download PA2423G Datasheet](../../../pndecoder/datasheets/SIGE/img/000003.gif) Click here to download PA2423G Datasheet*) |
![](http://www.chipdocs.com/common/img/1x10t.gif) |
*)Datasheets downloading from ChipDocs is only for our members (paid service). REGISTER NOW for your membership. |
|
|
|