The NIS3001 is an integrated multi-chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are packaged in a power QFN package called PInPAKTM. The 10.5 by 10.5 mm PInPAKTM package increases power density and simplifies PCB layout. The device can be used in single or multi-phase applications.