The kit contains representative input and output schematics, netlists, and waveform used for the ECLinPS Plus devices. This application note will be modified as new devices are added. The subcircuit models such as the input or output buffer, package, input ESD and output ESD may be interconnected as subcircuits to simulate specific device characteristics as shown in Figure 1 below. The block diagram in Figure 2 illustrates a typical situation which can be modeled using the information in this kit.