The Microsemi UM9601 series PIN diodes are constructed using a fused-in-glass which results in a highly reliable, hermetic package. The process utilizes symmetrical, full faced metallurgical bonds to both surfaces of the silicon chip. This construction greatly minimizes the normal parasitic inductance and capacitance found in conventional glass or ceramic packaged diodes which employ straps, springs, or whiskers. The use of discrete UM9601-UM9608 diodes greatly minimizes handling problems commonly associated with passivated PIN diode chips while maintaining good microwave performance. In addition the power handling capability of the UM9601-UM9608 series is considerably higher than PIN diode chips can provide. Environmentally, the UM9601-9608 series PIN diodes can withstand thermal cycling from -195 oC to +300 oC and exceed all military environmental specifications for shock, vibration, acceleration, and moisture.