The UM9441 is an axially leaded device constructed by metallurgically bonding the PIN chip in between two molybdenum refractory pins that are typically 0.125 inches in diameter and 0.050 inches long. Hyper-pure glass is then fused over this bond to form a void less seal. Leads are then brazed to ends of molybdenum pins. This results in a high-reliability package using materials so well thermally matched that the UM9441 can withstand temperature shock or cycling from -196 oC to +300 oC.