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| Partname: | LX5512ELQ |
| Description: | InGaP HBT 2.4-2.5 GHz power amplifier. |
| Manufacturer: | Microsemi Corp. |
| Package: | Plastic MLPQ |
| Pins: | 16 |
| Oper. temp.: | -40 to 85 |
| Datasheet: | PDF (209K).
Click here to download *) |
The LX5512E is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5512E an ideal solution for high-gain power amplifier requirements for IEEE 802.11b/g applications. |
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Click here to download LX5512ELQ Datasheet*) |
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