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Partname:LX5512BLQ
Description:InGaP HBT 2.4-2.5 GHz power amplifier.
Manufacturer:Microsemi Corp.
Package:Plastic MLPQ
Pins:16
Oper. temp.:-40 to 85
Datasheet:PDF (178K).
Click here to download *)

The LX5512B is available in a 16pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of LX5512B meets the requirements of high-gain power amplifiers for IEEE 802.11b/g applications.

Click here to download LX5512BLQ Datasheet
Click here to download LX5512BLQ Datasheet
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