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| Partname: | LX5506LQ |
| Description: | InGaP HBT 4.5-6 GHz power amplifier. |
| Manufacturer: | Microsemi Corp. |
| Package: | Plastic MLPQ |
| Pins: | 16 |
| Oper. temp.: | -40 to 85 |
| Datasheet: | PDF (285K).
Click here to download *) |
The LX5506 is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5506 an ideal solution for broadband, high-gain power amplifier requirements for IEEE 802.11a, and HiperLAN2 portable WLAN applications. |
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Click here to download LX5506LQ Datasheet*) |
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