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Partname:LX5503
Description:InGaP HBT 5-6GHz power amplifier
Manufacturer:Microsemi Corp.
Package:MLPQ
Pins:16
Oper. temp.:-40 to 85
Datasheet:PDF (473K).
Click here to download *)

The LX5503 is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5503 an ideal solution for broadband, medium-gain power amplifier requirements for IEEE 802.11a, and Hiperlan2 portable WLAN applications.

Click here to download LX5503 Datasheet
Click here to download LX5503 Datasheet
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