|
|
|
|
| Partname: | LX5503 |
| Description: | InGaP HBT 5-6GHz power amplifier |
| Manufacturer: | Microsemi Corp. |
| Package: | MLPQ |
| Pins: | 16 |
| Oper. temp.: | -40 to 85 |
| Datasheet: | PDF (473K). Click here to download *) |
The LX5503 is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5503 an ideal solution for broadband, medium-gain power amplifier requirements for IEEE 802.11a, and Hiperlan2 portable WLAN applications. |
|
 Click here to download LX5503 Datasheet*) |
 |
| *)Datasheets downloading from ChipDocs is only for our members (paid service). REGISTER NOW for your membership. |
|
|
|