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    | Partname: | MCCF33093 |  | Description: | Ignition control flip-chip |  | Manufacturer: | Motorola |  | Package: | Flip-chip |  | Pins: | 14 |  | Oper. temp.: | -30 to 140 |  | Datasheet: | PDF (49K). Click here to download *)
 |  | The MCCF33093 utilizes Flip-Chip Technology in which solder bumps, rather than traditional wire bonds, are created to establish mechanical and electrical contact to the chip. This process affords a unique device having improved reliability at elevated operating temperatures. Solder Bumped for Flip-Chip Assembly |  |  Click here to download MCCF33093 Datasheet*)
 |  |  |  | *)Datasheets downloading from ChipDocs is only for our members (paid service). REGISTER NOW for your membership. |  |  |  |