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Partname:MCCF33093
Description:Ignition control flip-chip
Manufacturer:Motorola
Package:Flip-chip
Pins:14
Oper. temp.:-30 to 140
Datasheet:PDF (49K).
Click here to download *)

The MCCF33093 utilizes Flip-Chip Technology in which solder bumps, rather than traditional wire bonds, are created to establish mechanical and electrical contact to the chip. This process affords a unique device having improved reliability at elevated operating temperatures. Solder Bumped for Flip-Chip Assembly

Click here to download MCCF33093 Datasheet
Click here to download MCCF33093 Datasheet
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