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Partname: | MCCF33093 |
Description: | Ignition control flip-chip |
Manufacturer: | Motorola |
Package: | Flip-chip |
Pins: | 14 |
Oper. temp.: | -30 to 140 |
Datasheet: | PDF (49K). Click here to download *) |
The MCCF33093 utilizes Flip-Chip Technology in which solder bumps, rather than traditional wire bonds, are created to establish mechanical and electrical contact to the chip. This process affords a unique device having improved reliability at elevated operating temperatures. Solder Bumped for Flip-Chip Assembly |
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![Click here to download MCCF33093 Datasheet](../../../pndecoder/datasheets/MOT/img/000552.gif) Click here to download MCCF33093 Datasheet*) |
![](http://www.chipdocs.com/common/img/1x10t.gif) |
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