|
|
|
|
| Partname: | MBRM140LT3 |
| Description: | Surface mount schottky power rectifier |
| Manufacturer: | Motorola |
| Package: | TO-220 |
| Pins: | 2 |
| Oper. temp.: | -65 to 150 |
| Datasheet: | PDF (133K). Click here to download *) |
The MCCF33093 utilizes Flip-Chip Technology in which solder bumps, rather than traditional wire bonds, are created to establish mechanical and electrical contact to the chip. This process affords a unique device having improved reliability at elevated operating temperatures. Solder Bumped for Flip-Chip Assembly |
|
 Click here to download MBRM140LT3 Datasheet*) |
 |
| *)Datasheets downloading from ChipDocs is only for our members (paid service). REGISTER NOW for your membership. |
|
|
|