The HiSpecGS connector features Molex's patented Ground by DesignTM contact system with two mating levels: longer power/ ground contacts and shorter high speed signal contacts. This innovative design offers low insertion force, a shorter signal electrical path, lower inductance and speeds over 400MHz. Molex's HiSpecGS connector features a 0.76mm (.030") pitch with 32 high speed signals and 34 power/ground contacts per linear inch, enabling its fast edge rate, low cross talk and high performance capabilities. The 330-circuit HiSpecGS connector is used in the Alpha Slot B 21264 processor for WTX platform work stations. Molex and Alpha Processor, Inc., the maker of the Alpha 21264 processor, worked together to develop this interconnect. The 108-circuit and 242-circuit HiSpecGS connectors will be used as the Memory Expansion Card Connector (MECC) for Rambus- based memory cards. The 108-circuit connector is for single channel Rambus applications; the 242-circuit connector is for dual channel Rambus applications.