The JDSU EPM 6xx Series PIN photodiodes are designed for optical network monitoring applications. The photodiode die is fabricated with a proprietary InGaAs process in our wafer fab and assembled into an hermetically-sealed package with antireflective-coated lens. A stainless steel bushing is used to actively couple the fiber to the package. The fiber is reinforced with a rubber boot, which relieves fiber bending stresses. EPM 6xx Series photodiodes can be produced with or without a variety of industry standard connectors. They are also available with mounting brackets, allowing both vertical panel and horizontal flush-to-board mounting. Low leakage versions (EPM 605LL and EPM 606LL) of the EPM 605 and EPM 606 are available with the same features, connectors, and brackets. Besides, we also offer the small form factor (SFF) packages (EPM635 and EPM635-75) that are designed for the SFF applications.