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Partname: | IRF6100PBF |
Description: | HEXFET Power MOSFET |
Manufacturer: | International Rectifier |
Datasheet: | PDF (618K). Click here to download *) |
The FlipFETTM package, is one-third the footprint of a comparable SOT-23 package and has a profile of less than .8mm. Combined with the low thermal resistance of the die level device, this makes the FlipFETTM the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards. |
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Click here to download IRF6100PBF Datasheet*) |
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