The HIP0045 is fabricated in a Power BiMOS IC process, and is intended for use in automotive and other applications having a wide range of temperature and electrical stress conditions. It is particularly suited for driving relays, solenoids and lamps in applications where low standby power, high operating voltage, and high output current in high ambient temperature conditions is required. The HIP0045 is in a 20 lead plastic Power SOP (PSOP) Package with an integral copper `slug' to conduct heat directly to a PCB interface or heat sink on the bottom of the package.