The Harris Semiconductor Dielectric Isolation process provides latch-up free operation while minimizing stray capacitance and leakage currents, to produce an excellent combination of speed and accuracy. Also, ground currents are minimized to produce a low and constant current through the ground terminal, which reduces error due to code-dependent ground currents. HS-565ARH die are laser trimmed for a maximum integral nonlinearity error of 0.25 LSB at +25oC. In addition, the low noise buried zener reference is trimmed both for absolute value and minimum temperature coefficient.