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Partname:TE28F800B3-B150
Description:Smart 3 advanced boot block 8-Mbit (512K x 16) flash memory. Access speed 150 ns
Manufacturer:Intel
Package:TSOP
Pins:48
Oper. temp.:-40 to 85
Datasheet:PDF (427K).
Click here to download *)

The new Smart 3 Advanced Boot Block, manufactured on Intel's latest 0.4 technology, represents a featurerich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective, monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide products will be available in 48-lead TSOP and 48-ball BGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flcomp.

Click here to download TE28F800B3-B150 Datasheet
Click here to download TE28F800B3-B150 Datasheet
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