The 3 Volt Intel Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package (Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3 Stacked-CSP memory device incorporates flash memory and static RAM in one package with low voltage capability to achieve the smallest system memory solution form-factor together with high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection register and flexible block locking to enable next generation security capability. Combined with the Intel Flash Data Integrator (Intel FDI) software, the C3 Stacked-CSP memory device provides a cost-effective, flexible, code plus data storage solution.