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Partname:RD28F3208C3B70
Description:32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns
Manufacturer:Intel
Package:BGA
Pins:66
Oper. temp.:-25 to 85
Datasheet:PDF (1M).
Click here to download *)

The 3 Volt Intel Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package (Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3 Stacked-CSP memory device incorporates flash memory and static RAM in one package with low voltage capability to achieve the smallest system memory solution form-factor together with high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection register and flexible block locking to enable next generation security capability. Combined with the Intel Flash Data Integrator (Intel FDI) software, the C3 Stacked-CSP memory device provides a cost-effective, flexible, code plus data storage solution.

Click here to download RD28F3208C3B70 Datasheet
Click here to download RD28F3208C3B70 Datasheet
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