The Smart 3 Advanced Boot Block, manufactured on Intel's latest 0.25 technology, represents a featurerich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40lead and 48-lead TSOP and 48-ball BGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flash.