The RMPA2271 Power Amplifier Module (PAM) is Fairchild's latest innovation in 50 matched, surface mount modules targeting WCDMA/UMTS applications. Answering the call for integrated Power Detection, the RMPA2271 offers the ability to measure power output over a 20dB range. This feature eliminates the need of an external power detector and lossy directional coupler, improving system perfomance and reducing overall cost. Simple two-state Vmode control is all that is needed to change the PA optimization from high power to low power mode to minimize current usage. The 3 x 3 x 1.0mm LCC package fits into the tightest spaces available on handset boards and is footprint compatible with existing 3 x 3mm LCC power amplifiers. The multi-stage GaAs Microwave Monolithic Integrated Circuit (MMIC) is manufactured using Fairchild's InGaP Heterojunction Bipolar Transistor (HBT) process.