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Partname: | RMPA2259 |
Description: | 3.4V WCDMA/CDMA PA Module |
Manufacturer: | Fairchild Semiconductor |
Package: | LCC(4x4mm) |
Pins: | 10 |
Datasheet: | PDF (235K). Click here to download *) |
The RMPA2259 power amplifier module (PAM) is designed for WCDMA/UTMS and HSDPA applications. The 2-stage PAM is internally matched to 50 to minimize the use of external components and features a low-power mode to reduce standby current and DC power consumption during peak phone usage. High power-added efficiency and excellent linearity are achieved using our InGaP Heterojunction Bipolar Transistor (HBT) process. |
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Click here to download RMPA2259 Datasheet*) |
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