The HB 56UW 873E belongs to 8 B yte DI MM (D ual In- line Memory Module) fa mily, and has bee n deve loped as an optimiz ed main memory solution for 4 and 8 B yte proc essor applica tions. The HB 56UW 873E is a 8M x 72 dynamic RAM module, mounted 9 pieces of 64-Mbit DRAM (HM5165805) sealed in TSOP package and 2 piec es of 16-bit line drive r sea led in TS SOP pac kage . The HB 56UW 873E off ers Extende d Da ta Out (ED O) Page Mode as a high speed access mode. An outline of the HB56UW873E is 168-pin socket type package (dual lea d out). The ref ore, the HB 56UW 873E make s high density mounting possible without surf ace mount tec hnology. The HB 56UW 873E provide s common data inputs and outputs. De coupling ca pac itor s ar e mounted beside each TSOP on the its module board.