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Partname:M4641-20
Description:Baseband processor for GSM application
Manufacturer:
Package:BGA
Oper. temp.:-30 to 85
Datasheet:PDF (359K).
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The baseband processing tasks are divided between the two processor cores. The DSP core executes the physical layer processing functions and the microcontroller core executes the Layer 2 and Layer 3 protocol software and the Man-Machine Interface (MMI) functions. The two cores communicate through a dedicated block of dual port memory. Each of the functional blocks in the device can be individually powered down to ensure minimum current consumption in the idle or standby mode. A block diagram of the device is provided in Figure 1. The BP is packaged in a 160-pin micro Ball Grid Array (BGA) with a 16-bit data bus and a 22-bit address bus. The package and pin configuration of the BP are shown in Figure 2. The signal pin assignments and functional pin descriptions are provided in Table 1.

Click here to download M4641-20 Datasheet
Click here to download M4641-20 Datasheet
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