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| Partname: | PACDN1404 |
| Description: | ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| Manufacturer: | California Micro Devices |
| Datasheet: | PDF (51.5K).
Click here to download *) |
The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. |
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Click here to download PACDN1404 Datasheet*) |
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