These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, +8kV contact discharge). All I/Os are rated at +25kV using the IEC 61000-4-2 contact discharge method. Using the MILSTD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill.