The AWT6302R meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with very few layout changes to the phone board. The PA module is optimized for VREF = +2.85 V. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and