A low-profile package whose chip cavity or mounting area occupies a major fraction of the package area and whose terminals consist of metal pad surfaces (on the leadless versions) or leads formed around the sides and under the package or out from the package (on leaded versions).

NOTES

1. The body of the chip carrier, usually square or of low aspect ratio, is similar to that of a flatpack.
2. When leads extend out from the package, the preferred term is flatpack (see FP).