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Philips Semiconductors logo
Part numbering system
  • Consumer and industrial products
    (prefixes PC, SA, TD, TE, TS, UA, UM)

  • Linear and RF products
  • High-speed CMOS producs
  • PLD producs
  • Microcontroller producs
  • Consumer and industrial products part numbering system (prefixes PC, SA, TD, TE, TS, UA, UM)

        Click on the graphic to see how the information is encoded.

    Consumer and industrial products part numbering system exapmle Package code Package code Package code on part Package code on part Operating temperature Operating temperature

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    Linear and RF products

        Click on the graphic to see how the information is encoded.

    Linear and RF products part numbering system exapmle Package code Package code

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    High-speed CMOS producs

        Click on the graphic to see how the information is encoded.

    High-speed CMOS producs Package code Package code

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    PLD producs

        Click on the graphic to see how the information is encoded.

    PLD producs Package code Package code

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    Microcontroller products

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    Microcontroller products part numbering system exapmle Package code Package code Package code on part Package code on part Operating temperature Operating temperature Speed Speed

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    Package codes

    CodePackage
    APlastic Leaded Chip Carrier (PLCC)
    A4444-pin Plastic Leaded Chip Carrier (PLCC)
    A6868-pin Plastic Leaded Chip Carrier (PLCC)
    A8484-pin Plastic Leaded Chip Carrier (PLCC)
    BQuad Flat Pack (QFP)
    BB1100-pin Plastic Quad Flat Pack (PQFP)
    BB2160-pin Plastic Quad Flat Pack (PQFP)
    BC44-pin Thin Quad Flat Pack (TQFP)
    BE128-pin Low profile Flat Pack (LQFP)
    BP100-pin Thin Quad Flat Pack (TQFP)
    DPlastic SO
     
    CodePackage
    DBPlastic SSOP type II
     
    DKShrink Small Outline Package (SSOP)
    FCeramic Dual In-Line
     
    FAHermetic Cerdip (window)
     
    FEHermetic Cerdip (8 Lead)
    KACerQuad (window)
     
    NPlastic Dual In-Line
     
    NBPlastic DIL; burn-in
     
    PWPlastic TSSOP type I
     
    UPlastic Single In-Line
     
     
     

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    Package codes on part

    CodePackage
    APlastic Leaded Chip Carrier (PLCC)
    BQuad Flat Pack (QFP)
    DCeramic Dual In-Line
     
    FHermetic Cerdip (window)
    GPQuad Flat Pack (QFP)
     
    LCerquad (window)
    CodePackage on part
    MShrink Small Outline Package (SSOP)
    PPlastic Dual In-Line
    QCeramic Quad Flat Pack (window)
    TPlastic SO
    WPPlastic Leaded Chip Carrier (PLCC)
     

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    Operating temperature

    CodeOperating temperature
    ANot specified (see data sheet)
    B0° to +70°C
    C-55°C to +125°C
    D-25°C to +70°C
    CodeOperating temperature
    E-25°C to +85°C
    F-40°C to +85°C
    H-40°C to +125°C
     

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    Speed

    CodeSpeed
    C12MHz
    E3.5MHz to 16MHz
    F1.2MHz to 16MHz
    G20MHz
    H32kHz to 12MHz
    CodeSpeed
    I24MHz
    P40MHz
    S0 to 16 MHz
    T0 to 24 MHz
    U0 to 33 MHz

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