K4R271669 series datasheets. Manufacturer: Samsung Electronic.

K4R271669AM-CG6 256K x 16 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R271669AM-CK7 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R271669AM-CK8 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R271669AN-CG6 256K x 16 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq 600 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R271669AN-CK7 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R271669AN-CK8 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R441869AM-CG6 256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R441869AM-CK7 256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R441869AM-CK8 256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R441869AN-CG6 256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R441869AN-CK7 256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R441869AN-CK8 256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C. Datasheet*) K4R271669B-MCG6 256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271669B-MCK7 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271669B-MCK8 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271669B-NCG6 256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271669B-NCK7 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271669B-NCK8 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271869B-MCG6 256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271869B-MCK7 256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271869B-MCK8 256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271869B-NCG6 256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271869B-NCK7 256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271869B-NCK8 256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C. Datasheet*) K4R271669A 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM Datasheet*) K4R441869A 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM Datasheet*) K4R271669B 256K x 16/18 bit x 32s banks Direct RDRAMTM Datasheet*) K4R441869B 256K x 16/18 bit x 32s banks Direct RDRAMTM Datasheet*) K4R271669D 128Mbit RDRAM(D-die) Datasheet*) K4R271669D-T 128Mbit RDRAM(D-die) Datasheet*) K4R271669D-TCS8 128Mbit RDRAM(D-die) Datasheet*) K4R271669E 128Mbit RDRAM(E-die) Datasheet*) K4R271669F 128Mbit RDRAM(F-die) Datasheet*)

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