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K4R271669 series datasheets. Manufacturer: Samsung Electronic.

K4R271669AM-CG6256K x 16 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R271669AM-CK7256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R271669AM-CK8256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R271669AN-CG6256K x 16 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq 600 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R271669AN-CK7256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R271669AN-CK8256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R441869AM-CG6256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R441869AM-CK7256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R441869AM-CK8256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R441869AN-CG6256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R441869AN-CK7256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R441869AN-CK8256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz. in 62-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 70°C.Datasheet*)
K4R271669B-MCG6256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271669B-MCK7256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271669B-MCK8256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271669B-NCG6256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271669B-NCK7256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271669B-NCK8256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271869B-MCG6256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271869B-MCK7256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271869B-MCK8256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271869B-NCG6256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271869B-NCK7256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. in 54-pin microBGA(normal CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271869B-NCK8256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. in 54-pin microBGA(mirrored CSP) package. Operational temperature range from 0°C to 100°C.Datasheet*)
K4R271669A256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTMDatasheet*)
K4R441869A256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTMDatasheet*)
K4R271669B256K x 16/18 bit x 32s banks Direct RDRAMTMDatasheet*)
K4R441869B256K x 16/18 bit x 32s banks Direct RDRAMTMDatasheet*)
K4R271669D128Mbit RDRAM(D-die)Datasheet*)
K4R271669D-T128Mbit RDRAM(D-die)Datasheet*)
K4R271669D-TCS8128Mbit RDRAM(D-die)Datasheet*)
K4R271669E128Mbit RDRAM(E-die)Datasheet*)
K4R271669F128Mbit RDRAM(F-die)Datasheet*)
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