| T7024-PGP | Bluetooth/ISM 2.4 GHz front-end IC. in 20-pin QFN package. Operational temperature range from -25°C to 85°C. | Datasheet*) |
| T7024-PGPM | Bluetooth/ISM 2.4 GHz front-end IC. in 20-pin QFN package. Operational temperature range from -25°C to 85°C. | Datasheet*) |
| T7024-PGQ | Bluetooth/ISM 2.4 GHz front-end IC. in 20-pin QFN package. Operational temperature range from -25°C to 85°C. | Datasheet*) |
| T7024-PGQM | Bluetooth/ISM 2.4 GHz front-end IC. in 20-pin QFN package. Operational temperature range from -25°C to 85°C. | Datasheet*) |
| T7024-TRQ | Bluetooth/ISM 2.4 GHz front-end IC. in 20-pin PSSO package. Operational temperature range from -25°C to 85°C. | Datasheet*) |
| T7024-TRS | Bluetooth/ISM 2.4 GHz front-end IC. in 20-pin PSSO package. Operational temperature range from -25°C to 85°C. | Datasheet*) |
| T7024 | Bluetooth??/ISM 2.4-GHz Front- End IC | Datasheet*) |
| T7024-PGM | A monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT. | Datasheet*) |
| T7024-TR | A monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT. | Datasheet*) |
| T7024-TRQY | A monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT. | Datasheet*) |
| T7024-TRSY | A monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT. | Datasheet*) |
